Principal/ Sr.Principal Digital Design Engineer

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

Principal Digital Design Engineer:

Role Overview

Join Astera Labs as a Principal Digital Design Engineer to architect and implement next-generation digital designs for high-performance AI connectivity solutions. You'll own complex blocks from micro-architecture through silicon bring-up, driving RTL implementation and collaborating with verification, physical design, and DFT teams to deliver production-quality silicon supporting PCIe Gen 6/7, CXL, UALink, UCI, Ethernet, and DDR4/DDR5 protocols.

This role offers the opportunity to work on cutting-edge technology at the forefront of AI infrastructure, taking ownership of critical design challenges in a fast-paced, collaborative environment where your contributions directly impact products deployed by the world's leading hyperscalers.

Key Responsibilities

• Design Ownership & Execution
• Verification & Integration
• Technical Leadership

Basic Qualifications

• Bachelor's degree in Electrical Engineering or equivalent
• 10+ years of hands-on experience developing complex SoC/silicon products in Server, Storage, and/or Networking markets
• Expertise in architecture definition, micro-architecture development, RTL coding, functional simulation, and synthesis
• Strong understanding of timing closure, gate-level simulation (GLS), and DFT implementation
• Deep expertise in at least one high-speed protocol: PCIe, CXL, Ethernet, DDR, or similar
• Production experience with advanced CMOS nodes (≤7nm)
• Proficiency with Cadence and/or Synopsys digital design flows

Preferred Qualifications

• Master's degree in Electrical Engineering or related field
• Track record of delivering multiple high-performance designs to production in data-center environments
• Hands-on collaboration with embedded firmware teams; understanding of firmware development challenges
• Familiarity with standard embedded processor subsystems (RISC-V, Arm, etc.)
• Proven contributions to design methodology, CAD automation, or design infrastructure

Salary range is $185,000 to $230,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.